Abstract:
Electromagnetic interference (EMI) poses a significant threat to the operational stability and reliability of modern electronic and communication systems. The increasing integration density of electronic components, particularly in aerospace, defense, and portable technologies, necessitates the development of lightweight, mechanically robust, and highly efficient shielding materials as alternatives to conventional bulk metals.
In this study, three-dimensional (3D) printed Polylactic Acid (PLA) and Polyethylene Terephthalate Glycol (PETG) polymers were metallized via an electroless plating process to enhance their electromagnetic shielding effectiveness (SE). [..]
Read more