THERMAL STABILITY OF TI/NI MULTILAYER THIN FILMS

1 VÁCLAVIK Richard
Co-authors:
1 ZÁBRANSKÝ Lukáš 1 SOUČEK Pavel 1 SŤAHEL Pavel 2 BURŠÍK Jiří 3 FOŘT Tomáš 1 BURŠÍKOVÁ Vilma
Institutions:
1 Department of Physical Electronics, Faculty of Science, Masaryk University, Brno, Czech Republic, EU, richard.vaclavik@mail.muni.cz
2 Institute of Physics of Materials, Czech Academy of Sciences, Brno, Czech Republic, EU, bursik@ipm.cz
3 Institute of Scientific Instruments, Czech Academy of Sciences, Brno, Czech Republic, EU, fortt@isibrno.cz
Conference:
12th International Conference on Nanomaterials - Research & Application, Brno, Czech Republic, EU, October 21 - 23, 2020
Proceedings:
Proceedings 12th International Conference on Nanomaterials - Research & Application
Pages:
518-523
ISBN:
978-80-87294-98-7
ISSN:
2694-930X
Published:
28th December 2020
Proceedings of the conference were published in Web of Science and Scopus.
Metrics:
539 views / 269 downloads
Abstract

In this work, thermal stability and mechanical properties of Ti/Ni multilayer thin films were studied. The multilayer thin films were synthesised by alternately depositing Ti and Ni layers using magnetron sputtering. The thickness of constituent layers of Ti and Ni varied from 1.7 nm to 10 nm, and one coating was deposited by simultaneous sputtering of both targets. Single crystalline silicon was used as a substrate. The effects of thermal treatment on the mechanical properties were studied using nanoindentation and discussed in relation to microstructure evaluated by X-ray diffraction. Annealing was carried out under low-pressure conditions for 2 hours in the range of 100–800 °C.

Keywords: Ti/Ni, multilayers, magnetron sputtering, nanoindentation, annealing

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