Nowadays preparation of structures on flexible substrates is highly demanded because of using this patterns in field of flexible electronics. This contribution deals with photolitographic procces for preparation of structures on flexible substrates. The method of photolitography enables to create designed patterns in various material (e.g. metals as conductive layers) on various substrates (silicon wafers, foils, etc.). First the designed pattern is exposed through the mask by UV light into polymer resist, then the pattern is transfered into metal layer by wet etching through the developed windows in resist. In this paper several patterns are prepared through the positive resist PMMA by photolitography into various metal layer (Cu, Al) on flexible substrates.Keywords: photolithography, flexible substrates, metal layer
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