from the conferences organized by TANGER Ltd. provisional website
The paper deals with the study of layers applied by magnetic sputtering on samples for electron microscopy to obtain electric conductive surface. It describes the effect of different deposition parameters on the change of the surface morphology of the samples. The reference substrate is pure Si wafer; as the coating material was selected the most commonly used gold and platinum. Scanning Electron Microscopy and Atomic Force Microscopy were used for qualitative and quantitative evaluation of the structural changes.Keywords: scanning electron microscopy, charge compensation, sputter coating
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