Article Back

STUDY OF GROWTH KINETICS OF INTERMETALLIC PHASES IN CU-SN SOLDER JOINTS UNDER THE CONDITIONS OF REACTIVE DIFFUSION

1 DRÁPALA Jaromír
Co-authors:
1 KOSTIUKOVÁ Gabriela 1 FRANCOVÁ Hana 1 LOSERTOVÁ Monika 2 KUBÍČEK Petr
Institutions:
1 VSB - Technical University of Ostrava, Ostrava, Czech Republic, EU, Jaromir.Drapala@vsb.cz
2 Na Čtvrti 14, 703 00 Ostrava – Hrabůvka, Czech Republic, EU
Conference:
30th Anniversary International Conference on Metallurgy and Materials, Brno, Czech Republic, EU, May 26 - 28, 2021
Proceedings:
Proceedings 30th Anniversary International Conference on Metallurgy and Materials
Pages:
1023-1029
ISBN:
978-80-87294-99-4
ISSN:
2694-9296
DOI:
https://doi.org/10.37904/metal.2021.4250
Published:
15th September 2021
Proceedings of the conference have already been published in Scopus and we are waiting for evaluation and potential indexing in Web of Science.
Metrics:
324 views / 212 downloads
View Full-text Download PDF
Abstract

The content of the paper is a brief description of the basic characteristics of the reactive diffusion in the dissolution of solid copper in the melt of tin solder. Furthermore, it deals with the theory of growth kinetics of intermetallic phases during heat treatment, and a description of lead-free solders and related problems during soldering. Experimental part contains layout and design of experiments suitable for the study of reactive diffusion, metallographic study and x-ray EDX microanalysis of samples, the calculations of diffusion flows and determination of the rate constants of dissolution.

Keywords: Reactive diffusion, dissolving, lead-free solders, tin-copper system, intermetallic phase

© This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Scroll to Top