from the conferences organized by TANGER Ltd.
Copper-silver alloys are preferred alloys when it is desired to maintain the electrical conductivity and mechanical strength values at room temperature, at high temperatures, and where it is necessary to have higher creep strength and softening temperature than ordinary copper alloys. In this study, the effect of phosphorus content and cold deformation ratio were investigated on the mechanical properties and electrical conductivity of a copper-silver alloy which is called CuAg0.1 (CW016A). Microstructure of the alloys were examined by light optic microscope (LOM) and scanning electron microscopy (SEM). When the phosphorus content of the alloy exceeded the limit value given in the standards, the electrical conductivity value decreased below the standard value, while the hardness increased.
Keywords: Copper silver alloy, hot forging, cold forging, microstructure© This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.