Copper and nickel-based solders with embedded particles of various sizes of tungsten carbide are widely used in industry. These particles are characterized by high hardness and abrasion resistance, erosion resistance, etc. They can be applied both during renovation and in the manufacturing of new parts for decrusters, screw conveyors and other stressed parts. Each of these parts requires a different surface character, and therefore, a different size of the tungsten carbide particles in the tough solder matrix. Machine components with a deposition soldered surface can be classified into the group of composite materials to replace standard parts from quality steels. The tested soldering materials based on Ni, Cu were applied to the surface using solder brazing technology on the substrate steel S235JR. The diameter of tungsten carbide particles used in these matrices ranges from 38 µm up to 6.0 mm.This research is focused on assessing the microstructure of selected areas, microhardness measurement and a microstructure analysis using a scanning electron microscope. Using a spot chemical analysis, the movement of partial chemical elements between the base material, solder and carbide particles was investigated.Keywords: Soldering, tungsten carbide, brazing, abrasion resistance
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