Copper and aluminum are both widely applicable in a variety of industrial and commercial branches, from automotive to electrotechnics and laminated materials and clad composites are innovative and perspective solutions for various applications. This study deals with the investigation of structure development via internal stress analyses, grains size observation, and residual stress analyses within Al-Cu clad composites rotary swaged at room temperature and at 250 °C by optical and electron microscopy, EBSD analyses and microhardness measurements. The swaged composites were also subjected to post-process heat treatment – annealing at 350 °C for 30 minutes. The results showed that intermetallic phases developed at the interfaces especially when subjected to higher temperatures (warm swaging and annealing). On the other hand, these treatments resulted in a significant decrease in the residual stress, which was also influenced substantially by sub-structure development (grain refinement). The analyses were supplemented with microhardness measurements, the results of which were in accordance with the results of substructure development.Keywords: Clad composite, residual stress, scanning electron microscopy, EBSD, structure
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