RESIDUAL STRESS AND MICROSTRUCTURE IN AL-CU CLAD COMPOSITES AFTER ROTARY SWAGING AND POST-PROCESS HEAT TREATMENT

1 KOCICH Radim
Co-authors:
2 KUNČICKÁ Lenka
Institutions:
1 VSB - Technical University of Ostrava, Ostrava, Czech Republic, EU, radim.kocich@vsb.cz
2 Institute of Physics of Materials, Czech Academy of Sciences, Czech Republic, EU, kuncicka@ipm.cz
Conference:
28th International Conference on Metallurgy and Materials, Hotel Voronez I, Brno, Czech Republic, EU, May 22nd - 24th 2019
Proceedings:
Proceedings 28th International Conference on Metallurgy and Materials
Pages:
1253-1259
ISBN:
978-80-87294-92-5
ISSN:
2694-9296
Published:
4th November 2019
Proceedings of the conference were published in Web of Science and Scopus.
Metrics:
34 views / 10 downloads
Abstract

Copper and aluminum are both widely applicable in a variety of industrial and commercial branches, from automotive to electrotechnics and laminated materials and clad composites are innovative and perspective solutions for various applications. This study deals with the investigation of structure development via internal stress analyses, grains size observation, and residual stress analyses within Al-Cu clad composites rotary swaged at room temperature and at 250 °C by optical and electron microscopy, EBSD analyses and microhardness measurements. The swaged composites were also subjected to post-process heat treatment – annealing at 350 °C for 30 minutes. The results showed that intermetallic phases developed at the interfaces especially when subjected to higher temperatures (warm swaging and annealing). On the other hand, these treatments resulted in a significant decrease in the residual stress, which was also influenced substantially by sub-structure development (grain refinement). The analyses were supplemented with microhardness measurements, the results of which were in accordance with the results of substructure development.

Keywords: Clad composite, residual stress, scanning electron microscopy, EBSD, structure
Scroll to Top