NOVEL TECHNOLOGY FOR PRODUCTION OF COPPER COMPONENT AND PASTE USED IN THE PRODUCTION PROCESS OF ELECTRICAL CONTACTS OF SILICON CELLS

1,4 MUSZTYFAGA-STASZUK Małgorzata
Co-authors:
1,3 WOŹNY Krzysztof 1 PUTYNKOWSKI Grzegorz, 1,2 ZIĘBA Paweł 1,2 PANEK Piotr 3 MARYNOWSKI Przemysław
Institutions:
1 CBRTP SA Research and Development Center of Technology for Industry, Warsaw, Skylight Tower, Poland, EU, krzysztof.wozny@cbrtp.pl
2 Institute of Metallurgy and Materials Science of Polish Academy of Sciences PAS,Cracow, Poland, EU, pan-kozy@wp.pl
3 AGH University of Science and Technology, Cracow, Poland, EU, woznyk@agh.edu.pl
4 Silesian University of Technology, Welding Department, Gliwice, Poland, EU, malgorzata.musztyfaga@polsl.pl
Conference:
26th International Conference on Metallurgy and Materials, Hotel Voronez I, Brno, Czech Republic, EU, May 24th - 26th 2017
Proceedings:
Proceedings 26th International Conference on Metallurgy and Materials
Pages:
1983-1989
ISBN:
978-80-87294-79-6
ISSN:
2694-9296
Published:
9th January 2018
Proceedings of the conference were published in Web of Science and Scopus.
Metrics:
39 views / 13 downloads
Abstract

The paper presents results of research on a new type of copper component that enables the production of Cu paste. Two pastes were applied during investigations: 1 – Pv19B commercial paste manufactured by Du Pont, 2 – experimental containing more than 50 % copper. Investigations were made into electrical properties of solar cells, with front metallization made in a non-conventional way (using template/stencil) on computerized Solar-Lab positioning table and included the measurement of I-V curves of the photovoltaic solar cells. The specific contact resistance of front metallization of the solar cell was measured also onto measuring position Corescan. Using the presented results, we can reduce the cost of silicone metallization by 50%, replacing the previously used silver with cheaper copper (CuXX).

Keywords: Copper, screen-printing, photovoltaic cells, metallization, silver
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