MICROSTRUCTURE OF ALSI17/MG JOINTS FABRICATED BY DIFFUSION BONDING AT DIFFERENT TEMPERATURES

1 MOLA Renata
Institution:
1 Kielce University of Technology, Faculty of Mechatronics and Mechanical Engineering, Al. Tysiąclecia Państwa Polskiego 7, 25-314 Kielce, Poland, EU, rmola@tu.kielce.pl
Conference:
26th International Conference on Metallurgy and Materials, Hotel Voronez I, Brno, Czech Republic, EU, May 24th - 26th 2017
Proceedings:
Proceedings 26th International Conference on Metallurgy and Materials
Pages:
1887-1892
ISBN:
978-80-87294-79-6
ISSN:
2694-9296
Published:
9th January 2018
Proceedings of the conference were published in Web of Science and Scopus.
Metrics:
356 views / 215 downloads
Abstract

The AlSi17/Mg joints under analysis were produced by diffusion bonding. They contained intermetallic phases, which were a result of diffusion occurring at the AlSi17/Mg reactive interface. The microstructure and thickness of the bonding zone were dependent on the heating temperature. Two temperatures were analyzed: 420 °C and 440 °C. The bonding zone produced at the lower temperature was thinner (50 μm). It was composed of an Al3Mg2 intermetallic phase (observed on the AlSi17 side), an Mg17Al12 intermetallic phase (observed on the Mg side) and an Mg2Si phase. In this case the Mg2Si was irregularly distributed over the Al-Mg intermetallic phase matrix. Fine particles of Mg2Si phase were observed in the region adjacent to the AlSi17 and large areas of this phase were visible locally near large Si particles. When the temperature of the diffusion bonding process was higher, a much thicker bonding zone (about 400 μm) formed. The structural constituents detected there were: Al3Mg2 (on the AlSi17 side), Mg17Al12 and a solid solution of Al and Si in Mg (on the AZ91 side) and an Mg2Si phase. The distribution of the Mg2Si phase in the bonding zone was more regular; fine particles of this phase were visible all over the bonding zone.

Keywords: magnesium, aluminum alloy, diffusion bonding, intermetallic phases, microstructure

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