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One solution to overcoming these challenges is to optimize by tailoring microstructures of the copper plates used in the new tundish plate’s critical components. An approach that has proven effective in improving the thermal resistance of material to intergranular degradation is grain boundary junction in copper (GBJC) [1]. Results showed that the triple line tension has a considerable effect on grain growth, particle–boundary interactions and void shape, especially for nano-crystalline materials. Copper has been and will continue to be vital to thermal transmission and heat transfer applications. The copper plates of a tundish thin slab caster coated by electrodeposited Ni (Co) coating presented cracks and small Ni detachments on the meniscus area after some charge sequence (7 heats cast). We have observed on the copper plates more cracks and detachments of the Ni (Co) coating below the meniscus area. The cracks have mainly longitudinal direction and lead to the detachment of the coating. The remaining coating on the area below the meniscus has a dark grey colour while where the coating was completely detached the copper substrate presented a yellow colour due to the formation of brass alloy. Moreover on the bottom part of the plate some scars are present due to the wear between the solidifying metal and the protective coating. The presence of the wear scars on this area is normal for the mould plates. Nevertheless, on the same area the protective coating is cracked even if in a less intense mode compared to the meniscus area.

Keywords: grain, junction, tundish, continual casting, nickel

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